1. SOC RV1126, Pin to Pin compatible with RV1109;

2. DDR3L (Samsung K4B4G1646E BCNB)

A 4G bit DDR3 K4B4G1646E BCNB is attached to the front and back of the entire board, with a total of 8G bit DDR3;

3. SPI Nand Flash:

Version A is equipped with 2G bit SPI Nand Flash XT26G02AWSEGA

Version B is equipped with 4G bit SPI Nand Flash XT26G04AWSEGA

4. RMII PHY (RTL8201F)

5. Codec (ES8311)

6.Transformer (Network isolation transformer MS10232ANL)

Pin1	VCC5V0_OTG
Pin2	OTG_DM
Pin3	OTG_DP
Pin4	GND

9.Ethernet&Power Jack

Pin1	TX+	Pin6	RX-
Pin2	TX-	Pin7	POE78
Pin3	RX+	Pin8	POE78
Pin4	POE45	Pin9	GND
Pin5	POE45	Pin10	VCC12V_DCIN

10. Audio Connector

Pin1	LED1/PHYAD1
Pin2	LED0/PHYAD0
Pin3	RESET
Pin4	MICP
Pin5	GND
Pin6	LINE_OUT

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Back View specification

1.DDR3L (Samsung K4B4G1646E BCNB)

A 4Gbit DDR3 is attached to the front and back of the entire board, with a total of 8G bits;

2.MIPI DSI Connector

Pin1	IRQ	Pin11	MIPI_DSI_D3N
Pin2	PWR_EN	Pin12	MIPI_DSI_D3P
Pin3	RST	Pin13	MIPI_DSI_D0N
Pin4	I2C3_SDA	Pin14	MIPI_DSI_D0P
Pin5	I2C3_SCL	Pin15	GND
Pin6	GND	Pin16	MIPI_DSI_CLKN
Pin7	MIPI_DSI_D2P	Pin17	MIPI_DSI_CLKP
Pin8	MIPI_DSI_D2N	Pin18	GND
Pin9	MIPI_DSI_D1P	Pin19	VCC_12V
Pin10	MIPI_DSI_D1N	Pin20	VCC_12V

3.MIPI CSI Connector

Pin1	VCC3V3_SYS	Pin21	MIPI_CSI_RX0_D1N
Pin2	VCC3V3_SYS	Pin22	MIPI_CSI_RX0_D0P
Pin3	SPI0_CLK	Pin23	MIPI_CSI_RX0_D0N
Pin4	LED_PWM	Pin24	GND
Pin5	SPI0_CS0N	Pin25	MIPI_CSI_CLK0
Pin6	SPI0_MISO	Pin26	GND
Pin7	SPI0_MOSI	Pin27	PWM8
Pin8	I2C1_SDA	Pin28	IRC_AIN
Pin9	I2C1_SCL	Pin29	PWM11
Pin10	MIPI_RX0_PDN	Pin30	PWM9
Pin11	MIPI_RX0_RST	Pin31	IRC_BIN
Pin12	GND	Pin32	ZOOM_EN
Pin13	MIPI_CSI_RX0_CLKP	Pin33	PWM10
Pin14	MIPI_CSI_RX0_CLKN	Pin34	P-IRIS_EN
Pin15	GND	Pin35	FOCUS_EN
Pin16	MIPI_CSI_RX0_D2P	Pin36	ADC_IN
Pin17	MIPI_CSI_RX0_D2N	Pin37	GND
Pin18	MIPI_CSI_RX0_D3P	Pin38	VCC_1V8
Pin19	MIPI_CSI_RX0_D3N	Pin39	VCC_12V
Pin20	MIPI_CSI_RX0_D1P	Pin40	VCC_12V

4.Function Connector

Pin1	HOST_DM	Pin14	SDMMC0_D0
Pin2	HOST_DP	Pin15	SDMMC0_CLK
Pin3	GND	Pin16	SDMMC0_D3
Pin4	GND	Pin17	RS485_CTL
Pin5	ALARM_IN	Pin18	UART3_RX_485
Pin6	SDMMC0_DET	Pin19	UART3_TX_485
Pin7	ALARM_OUT	Pin20	GND
Pin8	SDMMC0_PWREN	Pin21	VCC_12V
Pin9	SDMMC0_D2	Pin22	VCC_12V
Pin10	USB_PWREN	Pin23	POE45
Pin11	SDMMC0_CMD	Pin24	POE78
Pin12	GND	Pin25	POE36
Pin13	SDMMC0_D1	Pin26	POE12

1.1 Overview
RV1126 is a high-performance vision processor SoC for IPC/CVR, especially for AI-related applications. It is based on a quad-core ARM Cortex-A7 32-bit core which integrates NEON and FPU. There is a 32KB I-cache and 32KB D-cache for each core and a 512KB unified L2 cache. The build-in NPU supports INT8/INT16 hybrid operation and computing power is up to 2.0TOPs. In addition, with its strong compatibility, network models based on a series of frameworks such as TensorFlow/MXNet/PyTorch/Caffe can be easily converted.<br>
RV1126 also introduces a new generation totally hardware-based 14-megapixel ISP (image signal processor) and post-processor. It implements a lot of algorithm accelerators usually used in IPC and CVR, such as HDR, 3A functions (AE, AF, AWB), LSC, 3DNR, 2DNR, sharpening, dehaze, fisheye correction, gamma correction, feature points detection and so on. All of them are real-time processing. Cooperating with two MIPI CSI (or LVDS/SubLVDS) and one DVP (BT.601/BT.656/BT.1120) interface, users can build a system that receives video data from 3 camera sensors simultaneous.
The video encoder embedded in RV1126 supports UHD H.265/H.264 encoding. It also supports multi-stream encoding, up to one 4Kp30 and one 1080p30 simultaneous. With the help of this feature, the video from the camera can be encoded with higher resolution and stored in local memory and transferred to another lower resolution video to cloud storage at the same time. The H.264/H.265 video decoder in RV1126 supports 4Kp30 for H.264 and H.265.
In addition to the previous high-performance multimedia block, RV1126 also contains rich audio, memory, and other peripheral interfaces such as I2C, SPI, PWM, and so on. These can help users add more sensors or other peripherals into the whole system to improve flexibility and expansibility.
RV1126 has high-performance external DRAM (DDR3/DDR3L/DDR4/LPDDR3/LPDDR4-2133) capable of sustaining demanding memory bandwidths.
1.2 Features
The features listed below which may or may not be present in an actual product may be subject to the third-party licensing requirements. Please contact Rockchip for actual product feature configurations and licensing requirements.
1.2.1 Application Processor
 Quad-Core Cortex-A7
 Full implementation of the ARM architecture v7-A instruction set, ARM Neon Advanced SIMD
 Separately Integrated Neon and FPU
 32KB L1 I-Cache and 32KB L1 D-cache per Cortex-A7 CPU
 Unified 512KB L2 Cache for Quad-Core Cortex-A7
 TrustZone technology supported
 Separate power domains for CPU core system to support internal power switch and externally turn on/off based on the different application scenario
 PD_CPU0: 1st Cortex-A7 + Neon + FPU + L1 I/D Cache
 PD_CPU1: 2nd Cortex-A7 + Neon + FPU + L1 I/D Cache
 PD_CPU2: 3rd Cortex-A7 + Neon + FPU + L1 I/D Cache
 PD_CPU3: 4th Cortex-A7 + Neon + FPU + L1 I/D Cache
 One isolated voltage domain to support DVFS
1.2.2 Video Input Interface
 Interface and video input processor
 Two MIPI CSI/ LVDS/SubLVDS interfaces, 4 lanes each, MIPI CSI max data rate is 2.5Gbps/lane, LVDS/SublVDS max data rate is 1Gbps/lane
 On 8/10/12/16-bit standard DVP interface, up to 150MHz input data
 Support BT.601/BT.656 and BT.1120 VI interfaces
 Support the polarity of pixel_clk、hsync、vsync configurable
<span style=”color: #ffffff;”>RV1126 Datasheet Rev 1.4</span>
 ISP
 The maximum resolution is 14Mpixel(4416×3312)
 DVP input: ITU-R BT.601/656/1120 with raw8/raw10/raw12/raw16, YUV422
 MIPI input: RX data lane x1/x2/x4, raw8/raw10/raw12, YUV422
 3A: include AE/Histogram, AF, AWB statistics output
 FPN: Fixed Pattern Noise removal
 BLC: Black Level Correction
 DPCC: Static/Dynamic defect pixel cluster correction
 LSC: Lens shading correction
 Bayer-NR: Bayer-raw De-noising, 2DNR
 HDR: 3-/2-Frame Merge into High-Dynamic Range
 TMO: 3-/2-Frame Merge Video Tone mapping
 WDR: One Frame Wide-Dynamic Range Tone mapping
 Debayer: Advanced Adaptive Demosaic with Chromatic Aberration Correction
 CCM/CSM: Color correction matrix; RGB2YUV etc.
 Gamma: Gamma out correction
 Dehaze/Enhance: Automatic Dehaze and edge enhancement
 3DLUT: 3D-Lut Color Palette for Customer
 LDCH: Lens distortion in the horizontal direction
 Output Scale*3: support scale down level*3(W0&lt;3264; W1&lt;1280; W2&lt;1280)
 Output Scale*2: support scale down level*2(W0&lt;1920; W1&lt;1920)
 Output (FBC): support YUV422/420 with Frame Buffer Compression
 3DNR: Advanced Temporal Noise reduce in YUV
 2DNR: Advanced Spatial Noise reduce in YUV
 Sharp: Picture Sharpening &amp; Edge Enhance in YUV
 ORB: Oriented Fast and Rotated BRIEF, a method of feature points detection
 FEC: the bigger Lens-distortion and Fish Eye Correction
 CGC: Color Gamut Compression, YUV full range/limit range convert
1.2.3 Video CODEC
 Video Decoder
 Real-time decoding of H.264 and H.265
 Main and Main10 profile for H.265, up to level 5.0 and 4096×2304@30fps
 Baseline, main, high, high10 and high 4:2:2(without MBAFF), up to level 5.1 and 4096×2304@30fps
 Video Encoder
 Real-time UHD H.265/H.264 video encoding
 I-/P-frames and SmartP reference.
 Five bit rate control modes (CBR, VBR, FixQp, AVBR, and QpMap)
 Up to 100 Mbit/s output bit rate
 Support ROI(no limit) encoding;
 High profile for H.264, up to level 5.1 and 4096×2304@30fps
 Main profile for H.265, up to level 5.0 and 4096×2304@30fps
 Support multi-stream encoding
 3840 x 2160@30 fps + 1080p@30 fps encoding
 3840 x 2160@30 encoding + 3840 x 2160@30 fps decoding
 Input data format:
 YCbCr 4:2:0 planar
 YCbCr 4:2:0 semi-planar
 YCbYCr 4:2:2
 CbYCrY 4:2:2 interleaved
 RGB444 and BGR444
 RGB555 and BGR555
 RGB565 and BGR565
 RGB888 and BRG888
 RGB101010 and BRG101010
<span style=”color: #ffffff;”>RV1126 Datasheet Rev 1.4</span>
 One isolated voltage domain to support DVFS
1.2.4 JPEG CODEC
 JPEG Encoder
 Baseline (DCT sequential)
 Encoder size is from 96×96 to 8192×8192(67Mpixels)
 Up to 90 million pixels per second
 JPEG Decoder
 Decoder size is from 48×48 to 8176×8176(66.8Mpixels)
 Up to 76 million pixels per second
1.2.5 Neural Process Unit
 Neural network acceleration engine with processing performance up to 2.0 TOPS
 Support integer 8, integer 16 convolution operation
 Support deep-learning frameworks: TensorFlow, TF-lite, Pytorch, Caffe, ONNX, MXNet, Keras, Darknet
 Support OpenVX API
 One isolated voltage domain to support DVFS
1.2.6 Memory Organization
 Internal on-chip memory
 BootRom
 SYSTEM_SRAM in the voltage domain of VD_LOGIC
 PMU_SRAM in the voltage domain of VD_PMU for low power application
 External off-chip memory
 DDR3/DDR3L/DDR4/LPDDR3/LPDDR4-2133①
 SPI Flash
 eMMC
 SD Card
 Async Nand Flash
1.2.7 Internal Memory
 Internal BootRom
 Support system boot from the following device:
 FSPI Flash interface
 eMMC interface
 SDMMC interface
 Async Nand interface
 Support system code download by the following interface:
 USB OTG interface (Device mode)
 SYSTEM_SRAM
 Size: 64KB
 PMU_SRAM
 Size: 8KB
1.2.8 External Memory or Storage device
 Dynamic Memory Interface (DDR3/DDR3L/DDR4/LPDDR3/LPDDR4-2133)
 Compatible with JEDEC standards
 Compatible with DDR3/DDR3L/DDR4/LPDDR3/LPDDR4-2133
 Support 32-bit data width, 2 ranks (chip selects), max 4GB addressing space per rank, total addressing space is 4GB (max)
 Low power modes, such as power-down and self-refresh for SDRAM
 eMMC Interface
 Compatible with standard iNAND interface
 Compatible with eMMC specification 4.51
 Support three data bus widths: 1-bit, 4-bit or 8-bit
 Support up to HS200; but not support CMD Queue
<span style=”color: #ffffff;”>RV1126 Datasheet Rev 1.4</span>
 SD/MMC Interface
 Compatible with SD3.0, MMC ver4.51
 Data bus width is 4bits
 Flexible Serial Flash Interface(FSPI)
 Support transfer data from/to serial flash device
 Support x1, x2, x4 data bits mode
 Support 2 chips select
 Nand Flash Interface
 Support async nand flash
 Data bus width is 8bits
 Support 1 chip select
 Support LBA nand flash
 Up to 16bits/1KB hardware ECC
 Support configurable interface timing
1.2.9 System Component
 RISC-V MCU
 32bit microcontroller core with RISC -V ISA
 Harvard architecture, separate Instruction, and Data memories
 The instruction set is RV32I with M and C extensions
 Integrated Programmable Interrupt Controller (IPIC), all 123 IRQ lines connected to GIC for Cortex-A7 also connect to RISC –V MCU
 Integrated Debug Controller with JTAG interface
 CRU (clock &amp; reset unit)
 Support clock gating control for individual components
 One oscillator with 24MHz clock input
 Support global soft-reset control for the whole chip, also individual soft-reset for each component
 PMU (power management unit)
 Support 5 separate voltage domains VD_CORE/VD_LOGIC/VD_PMU/VD_NPU/VD_VEPU
 Support 14 separate power domains, which can be powered up/down by software based on different application scenes
 Multiple configurable work modes to save power by different frequency or automatic clock gating control or power domain on/off control
 Timer
 Support 6 64bit-timers with the interrupt-based operation for non-secure application
 Support 2 64bit-timers with the interrupt-based operation for secure application
 Support two operation modes: free-running and user-defined count
 Support timer work state checkable
 PWM
 Support 12 on-chip PWMs (PWM0~PWM11) with the interrupt-based operation
 The programmable pre-scaled operation to bus clock and then further scaled
 Embedded 32-bit timer/counter facility
 Support capture mode
 Support continuous mode or one-shot mode
 Provides reference mode and outputs various duty-cycle waveform
 Optimized for IR application for PWM3, PWM7, and PWM11
 Watchdog
 32-bit watchdog counter
 The counter counts down from a preset value to 0 to indicate the occurrence of a timeout
 WDT can perform two types of operations when the timeout occurs:
 Generate a system reset
 First, generate an interrupt and if this is not cleared by the service routine by the time a second timeout occurs then generate a system reset
 Programmable reset pulse length
<span style=”color: #ffffff;”>RV1126 Datasheet Rev 1.4</span>
 Totally 16 defined ranges of the main timeout period
 One Watchdog for non-secure application
 One Watchdog for secure application
 Interrupt Controller
 Support 128 SPI interrupt sources input from different components
 Support 16 software-triggered interrupts
 Two interrupt outputs (nFIQ and nIRQ) separately for each Cortex-A7, both are low-level sensitive
 Support different interrupt priorities for each interrupt source, and they are always software-programmable
 DMAC
 Micro-code programming-based DMA
 Linked list DMA function is supported to complete scatter-gather transfer
 Support data transfer types with memory-to-memory, memory-to-peripheral, peripheral-to-memory
 Signals the occurrence of various DMA events using the interrupt output signals
 One embedded DMA controller for the system
 DMAC features:
 Support 8 channels
 27 hardware requests from peripherals
 2 interrupts output
 Support TrustZone technology and programmable secure state for each DMA channel
 Secure System
 Cipher engine
 Support SM2/SM3/SM4 cipher
 Support SHA-1, SHA-256/224, SHA-512/384, and MD5 with hardware padding
 Support Link List Item (LLI) DMA transfer
 Support AES-128 AES-256 encrypt &amp; decrypt cipher
 Support AES ECB/CBC/OFB/CFB/CTR/CTS/XTS mode
 Support DES &amp; TDES encrypt &amp; decrypt cipher
 Support DES/TDES ECB/CBC/OFB/CFB mode
 Support up to 4096 bits PKA mathematical operations for RSA/ECC
 Support up to 8-channel configuration
 Support Up to 256 bits of TRNG output
 Support data scrambling for all DDR types
 Support secure OTP
 Support secure debug
 Support secure OS
 Mailbox
 One Mailbox in SoC to service A7 and RISC-V MCU communication
 Support four mailbox elements per mailbox, each element includes one data word, one command word register, and one flag bit that can represent one interrupt
 Provide 32 lock registers for software to use to indicate whether the mailbox is occupied
 DECOM
 Support for decompressing GZIP files
 Support for decompressing LZ4 files, including the General Structure of LZ4 Frame format and the Legacy Frame format.
 Support for decompressing data in Deflate format
 Support for decompressing data in ZLIB format
 Support complete interrupt and error interrupt output
 Support Hash32 check in the LZ4 decompression process
 Support the limit size function of the decompressed data to prevent the memory from being maliciously destroyed during the decompression process
 Support software to stop the decompression process
<span style=”color: #ffffff;”>RV1126 Datasheet Rev 1.4</span>
1.2.10 Graphics Engine
 2D Graphics Engine (RGA):
 Source formats:
 ABGR8888, XBGR888, ARGB8888, XRGB888
 RGB888, RGB565
 RGBA5551, RGBA4444
 YUV420 planar, YUV420 semi-planar
 YUV422 planar, YUV422 semi-planar
 YUV 10-bit for YUV420/422 semi-planar
 BPP8, BPP4, BPP2, BPP1
 Destination formats:
 ABGR8888, XBGR888, ARGB8888, XRGB888
 RGB888, RGB565
 RGBA5551, RGBA4444
 YUV420 planar, YUV420 semi-planar
 YUV422 planar, YUV422 semi-planar
 Pixel Format conversion, BT.601/BT.709
 Max resolution: 8192×8192 source, 4096×4096 destination
 BitBlt
 Two sources BitBLT:
 A+B=B only BitBLT, A support rotate and scale when B fixed
 A+B=C second source (B) has the same attribute as (C) plus rotation function
 Color fill with a gradient fill, and pattern fill
 High-performance stretch and shrink
 Monochrome expansion for text rendering
 New comprehensive per-pixel alpha (color/alpha channel separately)
 Alpha blending modes including Java 2 Porter-Duff compositing blending rules, chroma key, pattern mask, fading
 Dither operation
 0, 90, 180, 270-degree rotation
 x-mirror, y-mirror, and rotation operation
 Image Enhancement Processor (IEP):
 Image format
 Input data: YUV420/YUV422, semi-planar/planar, UV swap
 Output data: YUV420/YUV422, semi-planar, UV swap, Tile mode
 YUV down sampling conversion from 422 to 420
 Max resolution for dynamic image up to 1920×1080
 De-interlace
1.2.11 Display Interface
 One up to 24 bits RGB parallel video output interface
 One BT.1120 video output interface
 One 4-lane MIPI DSI interface, up to 1Gbps per lane
 Up to 1080p@60fps
1.2.12 Video Output Processor (VOP)
 Up to 1920×1080 @60fps
 Multiple layer
 Background layer
 Win0 layer
 Win2 layer
 Input format: RGB888, ARGB888, RGB565, YCbCr422, YCbCr420, YCbCr444
 1/8 to 8 scaling-down and scaling-up engine
 Support virtual display
 256 level alpha blending (pre-multiplied alpha support)
 Transparency color key
<span style=”color: #ffffff;”>RV1126 Datasheet Rev 1.4</span>
 YCbCr2RGB (rec601-mpeg/ rec601-jpeg/rec709)
 RGB2YCbCr (BT.601/BT.709)
 Support multi-region
 Win0 layer and Win2 layer overlay exchangeable
 Support RGB or YUV domain overlay
 BCSH (Brightness, Contrast, Saturation, Hue adjustment)
 BCSH: YCbCr2RGB (rec601-mpeg/ rec601-jpeg/rec709)
 BCSH: RGB2YCbCr (BT.601/BT.709)
 Support Gamma adjust
 Support dither down allegro RGB888to666 RGB888to565 &amp; dither down FRC (configurable) RGB888to666
 Blank and black display
1.2.13 Audio Interface
 I2S0 with 8 channels
 Up to 8 channels TX and 8 channels RX path
 Audio resolution from 16bits to 32bits
 Sample rate up to 192KHz
 Provides master and slave work mode, software configurable
 Support 3 I2S formats (normal, left-justified, right-justified)
 Support 4 PCM formats (early, late1, late2, late3)
 I2S and PCM mode cannot be used at the same time
 I2S1/I2S2 with 2 channels
 Up to 2 channels for TX and 2 channels RX path
 Audio resolution from 16bits to 32bits
 Sample rate up to 192KHz
 Provides master and slave work mode, software configurable
 Support 3 I2S formats (normal, left-justified, right-justified)
 Support 4 PCM formats (early, late1, late2, late3)
 I2S and PCM cannot be used at the same time
 PDM
 Up to 8 channels
 Audio resolution from 16bits to 24bits
 Sample rate up to 192KHz
 Support PDM master receive mode
 TDM
 Support up to 8 channels for TX and 8 channels for RX path
 Audio resolution from 16bits to 32bits
 Sample rate up to 192KHz
 Provides master and slave work mode, software configurable
 Support 3 I2S formats (normal, left-justified, right-justified)
 Support 4 PCM formats (early, late1, late2, late3)
 Audio PWM
 Support convert PCM to PWM format
 Sample rate up to 16x
 Support linear interpolation for 2x/4x/8x/16 oversampling
 Support 8/9/10/11 bits maskable L/R channel PWM output
 Digital Audio Codec
 Support 3-channel digital ADC
 Support 2-channel digital DAC
 Support I2S/PCM interface
 Support I2S/PCM master and slave mode
 Support 4-channel audio transmitting in I2S mode
 Support 2-channel audio receiving in I2S mode
 Support 2-channel audio transmitting or receiving in PCM mode
 Support 16~24 bit sample resolution for both digital ADC and digital DAC
<span style=”color: #ffffff;”>RV1126 Datasheet Rev 1.4</span>
 Both digital ADC and digital DAC support three groups of sample rates. Group 0 are 8khz/16khz/32kHz/64kHz/128khz, group 1 are 11.025khz/22.05khz/44.1khz/88.2khz/176.4khz and group 2 are 12khz/24khz/48khz/96khz/192khz
 The passband of digital ADC filters is 0.45625*fs
 Support digital ADC pass-band ripple within +/-0.1dB
 The stop-band of digital ADC filters is 0.5*fs
 Support digital ADC stop-band attenuation of at least 60dB
 Support volume control for both digital ADC and digital DAC
 Support Automatic Level Control (ALC)and noise gate for digital ADC
 Support communication with Analog Codec through I2C bus
1.2.14 Connectivity
 SDIO Interface
 Compatible with SDIO3.0 protocol
 4bits data bus widths
 GMAC 10/100/1000M ethernet controller
 Support 10/100/1000-Mbps data transfer rates with the RGMII interfaces
 Support 10/100-Mbps data transfer rates with the RMII interfaces
 Support both full-duplex and half-duplex operation  Support for TCP Segmentation Offload (TSO) and UDP Segmentation Offload (USO) network acceleration<br>
 USB 2.0 Host
 Compatible with USB 2.0 specification
 Supports high-speed(480Mbps), full-speed(12Mbps) and low-speed(1.5Mbps) mode
 Support Enhanced Host Controller Interface Specification (EHCI), Revision 1.0
 Support Open Host Controller Interface Specification (OHCI), Revision 1.0a
 USB 2.0 OTG
 Compatible Specification
 Universal Serial Bus Specification, Revision 2.0
 Extensible Host Controller Interface for Universal Serial Bus (xHCI), Revision 1.1
 Support Control/Bulk/Interrupt/Isochronous Transfer
 SPI Interface
 Support 2 SPI Controllers, support two chip-select output
 Support serial-master and serial-slave mode, software-configurable
 I2C Interface
 Support 6 I2C interfaces(I2C0-I2C5)
 Support 7bits and 10bits address mode
 Software programmable clock frequency
 Data on the I2C-bus can be transferred at rates of up to 100k bits/s in the Standard mode, up to 400k bits/s in the Fast mode, or up to 1m bits/s in Fast-mode Plus
 UART Interface
 Support 6 UART interfaces (UART0-UART5)
 Support 5bit, 6bit, 7bit, and 8bit serial data transmit or receive
 Standard asynchronous communication bits such as start, stop, and parity
 Support different input clocks for UART operation to get up to 4Mbps baud rate
 Support auto flow control mode(except UART2)
1.2.15 Others
 Multiple Groups of GPIO
 All of GPIOs can be used to generate an interrupt
 Support level trigger and edge trigger interrupt
 Support configurable polarity of level trigger interrupt
 Support configurable rising edge, falling edge, and both edge trigger interrupt
 Support configurable pull direction (a weak pull-up and a weak pull-down)
<strong>RV1126 Datasheet Rev 1.4</strong>
 Support configurable drive strength
 Temperature Sensor (TS-ADC)
 Support User-Defined Mode and Automatic Mode
 In User-Defined Mode, start_of_conversion can be controlled completely by software, and also can be generated by hardware.
 In Automatic Mode, the temperature of alarm(high/low temperature) interrupt can be configurable
 In Automatic Mode, the temperature of the system reset can be configurable
 Support to 2 channel TS-ADC (used for CPU and NPU respectively), the temperature criteria of each channel can be configurable
 -40~125°C temperature range and 5°C temperature resolution
 12-bit SAR ADC up to 732 S/s sampling rate
 Successive approximation ADC (SAR ADC)
 10-bit resolution
 Up to 1MS/s sampling rate
 6 single-ended input channels
 OTP
 Support 32Kbit space and higher 4k address space is a non-secure part.
 Support read and program word mask in a secure model
 Support program length from 1 to 32 bit
 Read operation support 8bit only
 Program and Read state can be read
 The program fails to address the record
 Package type
 FCCSP 409-pin (body: 14mm x 14mm; Ball size: 0.3mm; ball pitch: 0.65mm)
Notes:
①: DDR3/DDR3L/DDR4/LPDDR3/LPDDR4 is not used simultaneously

RKDevTool_Release_v2.74

https://drive.google.com/file/d/19rfUc4DJP5bPmdeCoDLsawo9b8zZxKMH/view?usp=sharing

SDK

https://drive.google.com/file/d/1CCNWHNNVi8FVG6UXNgrMDYsZx3SrpFyr/view?usp=sharing

Data sheet

RV1126-Vcan1748 Data Sheet

RV1126 RV1109 Quick Start

Rockchip_RV1126_RV1109_Quick_Start_Linux_EN

Rockchip Developer Guide RockX_SDK

Rockchip_Developer_Guide_RockX_SDK_CN

Rockchip_Developer_Guide_RockX_SDK_EN