PA1405/PA805 for DLM/DLB Module

This PA1405(or PA805) amplifier is a 5W linear power amplifier, designed for use with DLM/DLB module.

Features:

• Frequency band: 1425MHz-1455MHz(PA1405), 800MHz-830MHz(PA805)
• RF in: DLM(or DLB) module RF out(25±2dBm)
• RF out power: 5W(37dBm)
• PA1405 Tx gain: 15dB, when used with DLB/DLM Module, set up the maximum RF power of DLB/DLM as 22~25 dBm, then the RF out power will be 37~39dbm.
• PA805 Tx gain: 17dB, when used with DLB/DLM Module, set up the maximum RF power of DLB/DLM as 20~23 dBm, then the RF out power will be 37~39dbm.
• Power in: DC24V~25V, minimum 1.8A@24V power current rating
• Power consumption: <14W average
• PCBA size: 46.5*31mm, the thickness of PCB: 1.2mm
• Impedance: 50 ohm

Working together with DLM(or DLB) Module:

I/O

Power in	Two bonding pads should be soldered to connect with power VDD and GND.
Control	Two bonding pads should be soldered to connect with DLM(or DLB) Switch signal pad(SCL and GND). The input high(1.8V to 3.3V) will drive the amplifier and work in Tx mode. The input low will enable the PA module to work in Rx mode.
RF in	IPEX connector for connection with the main antenna of the DLM(or DLB) module.
RF out	The bonding pad should be soldered to an antenna connector.

Housing case and assemble

PA1405/PA805 is just an OEM PCBA module. When you use this PA to work with DLM(or DLB) module, you should make a metal housing case for your device, and a separate chamber must be designed for the PA board. And also, it should keep at least 6mm space between the PA board and the upper cover. The back side of the PA board should be assembled to the metal directly and tightly to help heat dissipation and enable an electrical grounding connection. For optimal performance, it is important to include adequate heat dissipation strategies that incorporate a heat sink or fan into any designs that integrate the PA OEM module.

we can also make a metal chamber for this PA module according to customer’s requirement.