DLM/DLBモジュール用PA1400/PA800

このPA1400(またはPA800) アンプは2Wリニアパワーアンプです, designed for using with DLM/DLB module

特徴:

• 周波数帯域: 1425MHz-1455MHz(PA1400), 800MHz-830MHz(PA800)
• RF入力: DLM(or DLB) module RF out(25±2dBm)
• RF出力電力: 2W(33dBmの)
• PA1400 Tx gain: 11dB, when used with DLM(or DLB) モジュール, set up the maximum RF power of DLM as 22~24 dBm, then the RF out power will be 33~35dbm.
• PA800 Tx gain: 13dB, when used with DLM(or DLB) モジュール, set up the maximum RF power of DLM as 20~22 dBm, then the RF out power will be 33~35dbm.
• 電源投入: DC12V~16V
• 消費電力: <6W平均
• PCBA size: 46.5*31ミリ, thickness of PCB: 1.2ミリ
• インピーダンス: 50 オーム

Working together with DLM(or DLB) モジュール:

I/O

電源投入	Two bonding pads, should be soldered to connect with power VDD and GND.
コントロール	Two bonding pads, should be soldered to connect with DLM(or DLB) Switch signal pad(SCLとGND). 入力高(1.8V～3.3V) will drive the amplifier and work in Tx mode. The input low will enable the PA module to work in Rx mode.
RF入力	IPEX connector for connection with main antenna of DLM(or DLB) module.
RF出力	Bonding pad, should be soldered to an antenna connector.

ハウジングケースと組み立て

PA1400/PA800 is just an OEM PCBA module. When you use this PA to work with DLM(or DLB) module, you should make metal housing case for your device, and a separated chamber must be designed for PA board. And also, it should keep at least 6mm space between the PA board and the upper cover. The back side of the PA board should be assembled to the metal directly and tightly to help heat dissipation and enable electrical grounding connection. For optimal performance it is important to include adequate heat dissipation strategies that incorporate a heat sink or fan into any designs that integrate the PA OEM module.