PA1400/PA800 for DLM/DLB Module

This PA1400(or PA800) amplifier is a 2W linear power amplifier, designed for using with DLM/DLB module

Fitur:

• Pita frekuensi: 1425MHz-1455MHz(PA1400), 800MHz-830MHz(PA800)
• Federasi Rusia di: DLM(atau DLB) modul RF keluar(25±2dBm)
• RF keluar daya: 2W(33dBm)
• PA1400 Tx gain: 11dB, when used with DLM(atau DLB) Modul, set up the maximum RF power of DLM as 22~24 dBm, then the RF out power will be 33~35dbm.
• PA800 Tx gain: 13dB, when used with DLM(atau DLB) Modul, set up the maximum RF power of DLM as 20~22 dBm, then the RF out power will be 33~35dbm.
• Daya masuk: DC12V~16V
• Konsumsi daya: <6Rata-rata W
• ukuran PCBA: 46.5*31mm, thickness of PCB: 1.2mm
• Impedansi: 50 ohm

Bekerja sama dengan DLM(atau DLB) Modul:

masukan/keluaran

Daya masuk	Two bonding pads, should be soldered to connect with power VDD and GND.
Kontrol	Two bonding pads, should be soldered to connect with DLM(atau DLB) Ganti papan sinyal(SCL dan GND). Masukannya tinggi(1.8V hingga 3.3V) akan menggerakkan amplifier dan bekerja dalam mode Tx. Input rendah akan memungkinkan modul PA bekerja dalam mode Rx.
Federasi Rusia di	IPEX connector for connection with main antenna of DLM(atau DLB) modul.
RF keluar	Bonding pad, should be soldered to an antenna connector.

Kasing perumahan dan rakit

PA1400/PA800 is just an OEM PCBA module. Saat Anda menggunakan PA ini untuk bekerja dengan DLM(atau DLB) modul, you should make metal housing case for your device, and a separated chamber must be designed for PA board. Dan juga, itu harus menjaga jarak setidaknya 6 mm antara papan PA dan penutup atas. The back side of the PA board should be assembled to the metal directly and tightly to help heat dissipation and enable electrical grounding connection. For optimal performance it is important to include adequate heat dissipation strategies that incorporate a heat sink or fan into any designs that integrate the PA OEM module.