PA1400/PA800 for DLM/DLB Module

This PA1400(or PA800) amplifier is a 2W linear power amplifier, designed for using with DLM/DLB module

риси:

• Діапазон частот: 1425MHz-1455MHz(PA1400), 800MHz-830MHz(PA800)
• РФ в: DLM(or DLB) module RF out(25±2 дБм)
• РЧ вихідна потужність: 2W(33дБм)
• PA1400 Tx gain: 11дБ, when used with DLM(or DLB) Модуль, set up the maximum RF power of DLM as 22~24 dBm, then the RF out power will be 33~35dbm.
• PA800 Tx gain: 13дБ, when used with DLM(or DLB) Модуль, set up the maximum RF power of DLM as 20~22 dBm, then the RF out power will be 33~35dbm.
• Вхід живлення: DC12V~16V
• Споживання енергії: <6W середній
• PCBA size: 46.5*31мм, thickness of PCB: 1.2мм
• Імпеданс: 50 ом

Working together with DLM(or DLB) Модуль:

I/O

Вхід живлення	Two bonding pads, should be soldered to connect with power VDD and GND.
КОНТРОЛЬ	Two bonding pads, should be soldered to connect with DLM(or DLB) Switch signal pad(SCL і GND). Вхід високий(1.8V до 3,3 В) will drive the amplifier and work in Tx mode. The input low will enable the PA module to work in Rx mode.
РФ в	IPEX connector for connection with main antenna of DLM(or DLB) модуль.
РЧ вихід	Bonding pad, should be soldered to an antenna connector.

Корпус і збірка

PA1400/PA800 is just an OEM PCBA module. When you use this PA to work with DLM(or DLB) модуль, you should make metal housing case for your device, and a separated chamber must be designed for PA board. And also, it should keep at least 6mm space between the PA board and the upper cover. The back side of the PA board should be assembled to the metal directly and tightly to help heat dissipation and enable electrical grounding connection. For optimal performance it is important to include adequate heat dissipation strategies that incorporate a heat sink or fan into any designs that integrate the PA OEM module.