Papan teras Rockchip RV1126 Modul pembangunan IPC AI Kecerdasan Buatan litar PCBA pinout tersuai ODM IP ethernet output RSTP H264/265
Ciri:
spesifikasi
CPU
• ARM Cortex-A7 1.5GHz teras 32-bit yang menyepadukan NEON dan FPU. Terdapat cache I 32KB dan cache D 32KB untuk setiap teras dan cache L2 bersatu 512KB.
• RSIC-V 400MHz
NPU
• 2Tops, menyokong INT8/ INT16
memori
• 32bit DDR4 1G
• Menyokong eMMC 8G
• Menyokong but pantas
paparan
• Antara muka MIPI-DSI/RGB, sehingga 1080P60fps
2D Enjin Grafik
• Putaran sokongan, x-cermin, y-cermin
• Support alpha blending
• Menyokong skala-turun/naik
Multi-Media
• ISP 14M 2.0 dengan 3F HDR(Berasaskan garisan/Bingkai- berasaskan/DCG)
• Menyokong 2*MIPI CSI /LVDS/sub-LVDS
• DVP interface with BT.656/BT.1120
• 4K H.264/H.265 30fps video encoder
• 3840 x 2160@30 fps+720p@30 fps pengekodan
• 4K H.264/H.265 30fps video decoder
• 3840 pengekodan x 2160@30 + 3840 x2160 @30fps penyahkodan
Antara muka luaran
• Antara muka RGMII dengan pecutan rangkaian TSO
• USB 2.0 OTG dan USB 2.0 • Dual SDIO 3.0 antara muka untuk Wi-Fi dan kad SD
• 8ch I2S dengan TDM/PDM, 2ch I2S
Ketersediaan
• 2020 Q4
• SMIC 14nm, QFN 156 1.0
SOC | RV1126, RV1109 |
Ram | 32-bit, 512MB*2 |
ROM | 8GB EMMC |
NPU | 0TOPS, menyokong bingkai RKNNAI |
antara muka USB | Dua USB, satu OTG bebas, satu HOS bebas |
Port bersiri UART | 6 Tahap TTL3.3V, salah satunya ialah Debug |
Antara Muka GPIO | 102 GPIO (Catatan: terdapat fungsi pemultipleksan, sila semak definisi pin dalam spesifikasi ini> |
antara muka PWM | 5-cara PWM mempunyai tahap 3.3V/1.8V masing-masing (sila semak definisi pin dalam spesifikasi ini) |
rancangan MIPI DSI | 1 saluran Maksimum 1920×1080 60fps |
CAN | 1 saluran |
paparan RGB | 1 saluran RGB 888 antara muka paparan, maksimum 1920×1080 |
Antara muka kamera DVP | 1 saluran antara muka kamera DVP selari 16-bit |
Antara muka kamera MIPI | 2 saluran antara muka kamera data MIPI CSI RAW (satu saluran 4K/30) |
Keluaran suara | 1 saluran Keluaran saluran kiri dan kanan |
input suara | 1 Input mikrofon silikon digital PDM, 1 input LANE_IN analog atau I2S |
Antara muka SDIO | 2 Antara muka SDIO, satu kad TF, satu lagi boleh disambungkan ke WIFI |
antara muka ADC | 6 antara muka ADC |
Antara muka I2C | 4 Antara muka I2C |
Antaramuka SPI | 2-cara antara muka SPI |
Ethernet | – one-way RGMII PHY interface, Gigabit Ethernet |
system upgrade | supports local USB upgrade |
saiz | 38*48mm |
PCB layers | FR4-6 layers |
Working range | -10℃-7o℃ |
As an RV1126 Rockchip core board circuit supplier, we also offer to pin out customized second development layout design produce services and products.
This AI artificial intelligence core module is an AI intelligent module designed based on Rockchip RV1126 high-performance AI processor, quad-core RV1126 ARM [email protected] 32-bit core, integrated NEON, and FPU. Each core has a 32KB l-cache and 32KB D-cache and 512KB unified L2 cache. Built-in NPU supports INT8/INT16 mixed operation, computing power up to 2TOPS Built-in RISC-V architecture MCU; supports Linux4.19 operating system, the network model has strong compatibility, supports a series of deep learning such as TensorFlow / MXNet / PyTorch! Caffe framework that is easy to convert. Super performance, fast system startup, and high stability.
Can be adapted to different face recognition algorithms, suitable for embedding in various AI vision products, widely used in binocular face recognition panel machines, AI binocular cameras, smart communities, smart doorbells, smart access control/cat’s eye, face payment, Related industries related to intelligent upgrades such as driving recorders, interaksi permainan, dan siaran web.